Since 2003, PLM International Conference (PLM IC) brings together researchers, developers, and users of Product Lifecycle Management (PLM), an integrated business approach to the collaborative creation, management and dissemination of engineering data throughout the extended enterprises that create, manufacture and operate engineered products and systems.

The conference aims at involving all stakeholders of the wide concept of PLM, hoping to shape the future of this new field and advance the science and practice of enterprise development. Since its beginning, PLM IC is the official conference of the Editorial Board of the International Journal of Product Lifecycle Management (IJPLM, www.inderscience.com/ijplm). Since 2009, PLM IC is the official conference of the IFIP Working Group WG 5.1 "Global Product development for the whole lifecycle" (www.ifip-wg51.org).

invites researchers, developers and users of PLM to share the recent results and to discuss where PLM will be going in this dynamically changing world of today. The conference will provide a good opportunity to understand the cutting edge frontiers and to interact with and establish networks with colleagues in academia and in industry in this field.Your active participation is welcome.
Topics of primary interest at PLM 14 are as follows, but other topics related to PLM are also welcome.
PLM for sustainability, traceability and performance
PLM and influence of/from social networks,
PLM infrastructure and implementation processes,
PLM maturity and improvement concepts,
PLM and collaborative product development,
Capture and reuse of product and process information,
PLM and knowledge management,
PLM and organizational change management,
PLM virtual and simulation environments,
Enterprise systems integration,
Interoperability and security issues,
PLM and the environment,
PLM educational and training approaches.
PLM across Industries
PLM across Countries (Globalization and Glocalization)
PLM and Engineering Management
PLM and Lifetime Value
Important Dates
Paper Submission
Getting there
Bay Area Map
(Welcome Dinner, Conference Site, Dinner Cruise)
Plenary Keynote Speaker Prof. Balan GurumoorthyNew
Plenary Keynote Speaker Prof.Yoshiaki OhkamiNew
Plenary Keynote Speaker
Prof. Lincoln Wood
Industry Session SpeakersNew
Final Program at a GlanceNew
Final ProgramNew
Dinner CruiseNew
Doctoral Workshop FinalNew
Directions to SDM Keio University Hiyoshi CampusNew
Visitors Information
For Visa ApplicationNew, Important
Final Paper Submission for the ConferenceNew, Important
For Those Looking for a Budget Business Hotel
Nissan Oppama Factory Tour
Design Manufacturing Center, Keio Uiversity VisitNew
Apply for Nissan Oppama Factory Tour Now.
Deadline is June 10. First come, first served, up to 30.

Emaill your application to Shuichi Fukuda at shufukuda@gmail.com with your name (First, Last), your position, your affiliation and your nationality.
If you have not received any review comments by the end of May, please prepare your final conference paper in pdf and in Springer format and submit it to Shuichi Fukuda at shufukuda@gmail.com by June 10.

Authors who have not received any notification yet, please contact Shuichi Fukuda at shufukuda@gmail.com urgently.

If you do not hear any comments by May 31, please go ahead and prepare your final conference paper.
Submit it by June 10 in PDF and Springer format to shufukuda@gmail.com
June 10 is the strict deadline. No extensions

Registration procedures uploaded. Click Registration for details.

Preliminary Program uploaded. Click Program for details

Doctoral WS details uploaded. Click Doctoral Workshop for details.

Full Paper Submission
Deadline is extended to
16th March, 2014
(Click Here for Word Template)

Click Here for IFIP
Newsletter of March, 2014

PLM Maturity Session is
organized by WG 5.1SIG/ARC8.
Please see the
Call for Papers

Abtract deadline is extended. New deadline is January 31, 2014

BIM (Building Information Modeling) session is organized. Please see the Call for Papers


For inquiries, contact :Shuichi Fukuda at shufukuda@gmail.com